PURPOSE: To protect a wire from falling of frame and contacting of frame with jig and drastically reduce wire bending and defective wire touch by providing protrusion in such a manner as surrounding a wire loop in such a height higher than the wire loop.

CONSTITUTION: A pellet (semiconductor element) 1 is fitted on a tab 2 and the pellet 1 and post leads 4, 5 are loop-connected by wire. Under this condition, protrusions 11, 12 which are higher than the height b of wire loop 7 are provided to the post leads 4, 5 in such a manner as surrounding rhe wire loop. Thereby, even when the lead frame has fallen with the surface facing to the pellet placed lower side, it is protected by protrusions 11, 12 and wire bending or wire touch can be prevented. The protrusions 11, 12 of post lead can be formed by bending a part of the end point of post leads 4, 5 at a right angle to the lead surface.