PURPOSE: To obtain a highly resistant device against external stress partially extending the interval between adjacent leads by holding plural number of leads between a substrate which mounts a semiconductor tip and a cap and sealing bubbles which are generated when the leads are sealed with glass.

CONSTITUTION: On a recessed portion at the center of a base 1 consisting of heat resisting insulation material such as ceramics, a semiconductor tip 2 is mounted, a pad for signal line connection adjacently installed and a lead frame 3 are connected by bonding with a wire 4 and the base 1 and a ceramic or metal cap 5 are sealed with glass. In this case, the sealed parts of the base 1 and the cap 5 are coated with low melting point glass 6 and 7 and the base 1, the lead frame 3 and the cap 5 are welded and fixed into an integral body. In this constitution, bubbles 13 generated in the glass sealing shown in a separate diagram are intentionally sealed to partially extend the interval between adjacent leads 11.