Title:
MANUFACTURE OF SINGLE CRYSTAL WAFER
Document Type and Number:
Japanese Patent JPH076984
Kind Code:
A
Abstract:
PURPOSE: To provide a method of manufacturing single crystal wafers, wherein the wafers can be lessened in cracking in device forming processes.
CONSTITUTION: A process 101 wherein a single crystal ball is sliced into pieces, a process 102 wherein both sides of a sliced wafer are lapped, a process 103 wherein the rear of a lapped wafer is roughened, a process 104 wherein the periphery of a wafer is chamfered after the process 103, and a process 105 wherein the other surface of a lapped wafer is polished into a mirror surface are provided.
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Inventors:
OKADO SHIGEO
Application Number:
JP14738593A
Publication Date:
January 10, 1995
Filing Date:
June 18, 1993
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
B24B9/00; C30B33/00; H01L21/304; H03H3/08; (IPC1-7): H01L21/304; B24B9/00; C30B33/00; H03H3/08
Attorney, Agent or Firm:
Suyama Saichi
Next Patent: SEMICONDUCTOR WAFER AND MANUFACTURE THEREOF