Title:
【発明の名称】硬質表面形成性材料を基体に施用する方法
Document Type and Number:
Japanese Patent JP2002512882
Kind Code:
A
Abstract:
An improved method of applying a particulate material to a substrate, includes the steps of: removing impurities from a surface of the substrate; forming a coating composition having a bonding material and at least one particulate material; applying the coating composition to the substrate surface; and creating a diffusion bond between the substrate, bonding material and particulate material for generating a continuous interface between the substrate surface and particulate material such that the change in mechanical properties between the substrate and particulate material occurs in a direction normal to the plane of the substrate surface, thereby minimizing residual strain and coefficient of thermal expansion mismatch between the substrate and particulate material, the surfaces of individual particles of said particulate material being chemically wetted by the bonding material. The particulate material and the bonding material comprise a layer on the substrate surface.
Inventors:
Aia Cocca, Ronald, Gee
Shibaraman, Kartik
Ral, Anand
German, Randall, M
Shibaraman, Kartik
Ral, Anand
German, Randall, M
Application Number:
JP2000545654A
Publication Date:
May 08, 2002
Filing Date:
April 22, 1999
Export Citation:
Assignee:
Penstate Research Foundation
International Classes:
B05D3/10; B05D3/12; C23C2/28; B05D1/12; C23C4/18; C23C10/60; C23C26/00; C23C26/02; (IPC1-7): B05D1/12; B05D3/10; B05D3/12
Attorney, Agent or Firm:
Akira Asamura (3 outside)