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Patent Searching and Data


Title:
SPUTTERING DEVICE
Document Type and Number:
Japanese Patent JPS6057941
Kind Code:
A
Abstract:
PURPOSE:To prevent the generation of cracks in a quartz target, to lengthen life and to form a thin-film having excellent quality by forming a metallic layer integrally shaped to the back of the target by a material, wetting properties thereof with a fixing material are excellent and alloying porperties thereof at the high melting point are low. CONSTITUTION:A Cr layer 17 is integrally formed previously to the back of a quartz board 14, nd the quartz board 14 is fixed to a packing plate 15 by wetting properties between the Cr layer 17 and a fixing material 16 (an alloy layer of In/Sn). Consequently, thermal stress is not concentrated because heat generated by a collision and a reaction with the quartz board 14 of Ar ions is dissipated rapidly to the packing plate 15 through the Cr layer 17 and the In/Sn alloy layer 16 and there is no air gap at that time. Accordingly, the generation of cracks in the quartz board 14 can be prevented, and the generation of foreign matters and a contamination to a formed film can be obviated.

Inventors:
OZAKI MAMORU
SASABE SHIYUNJI
Application Number:
JP16498683A
Publication Date:
April 03, 1985
Filing Date:
September 09, 1983
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
C23C14/34; H01L21/31; (IPC1-7): C23C14/34
Attorney, Agent or Firm:
Akio Takahashi