Title:
【発明の名称】電子部品搬送体の底材製造方法およびその製造装置
Document Type and Number:
Japanese Patent JP2851329
Kind Code:
B2
More Like This:
| JPS5156767 | NETSUSHIIRUGATANO SEIZOHOHO |
Inventors:
ORIMO YOJI
KURAMOCHI SADAO
AKIBA HIDETO
YAMASHITA RIKYA
MOMOTOME MASAAKI
KURAMOCHI SADAO
AKIBA HIDETO
YAMASHITA RIKYA
MOMOTOME MASAAKI
Application Number:
JP30803489A
Publication Date:
January 27, 1999
Filing Date:
November 28, 1989
Export Citation:
Assignee:
DAINIPPON INSATSU KK
International Classes:
B65B47/00; B65B15/04; (IPC1-7): B65B47/00; B65B15/04
Domestic Patent References:
| JP6044320A | ||||
| JP1226505A | ||||
| JP56128802U | ||||
| JP5025879B2 |
Attorney, Agent or Firm:
Kazuo Sato (3 others)