Title:
【発明の名称】導電性マイクロブリッジの製造方法
Document Type and Number:
Japanese Patent JP2926158
Kind Code:
B2
Abstract:
A method of manufacturing a conductive micro bridge includes the steps of preparing a semiconductor substrate, forming an insulating film on the semiconductor substrate, forming a sacrificial layer on the insulating film, forming a metal-oxide composite film on the sacrificial layer so as to surround the sacrificial layer, and removing the sacrificial layer to thereby form an air gap in the removed portion.
Inventors:
DON HI RI
Application Number:
JP24395095A
Publication Date:
July 28, 1999
Filing Date:
August 30, 1995
Export Citation:
Assignee:
ERU JII SEMIKON CO LTD
International Classes:
G01J1/02; C23F1/00; G01S3/781; H01L21/203; H01L21/28; H01L21/285; H01L21/30; H01L21/302; H01L21/3065; H01L21/316; H01L21/768; H01L23/482; H01L23/522; H01L27/14; H01L27/16; (IPC1-7): G01J1/02; H01L21/285; H01L21/3065; H01L21/768; H01L27/14
Domestic Patent References:
| JP63250155A | ||||
| JP410638A | ||||
| JP592349A | ||||
| JP53147531A | ||||
| JP52123871A | ||||
| JP1260831A | ||||
| JP6461025A |
Attorney, Agent or Firm:
Masaki Yamakawa