Title:
【発明の名称】電子回路装置の製造方法
Document Type and Number:
Japanese Patent JP3367201
Kind Code:
B2
Abstract:
An electronic circuit device manufacturing method and system by which an electronic circuit device having desired electronic circuit characteristics can be manufactured. After an arbitrary step of forming a layer of the electronic device, the shape of the pattern or the physical values of the layer are measured, or the monitoring information during the step about the manufacturing system are collected. The manufacturing process after the step is predicted by a simulator using the monitoring information to optimize the manufacturing conditions after the step or to correct the patterns. Since the manufacture process of the electronic circuit device is progressed by making necessary correction on patterns or manufacturing conditions, defective electronic circuit devices which have been discarded are recovered as nondefective products, resulting in an improvement in yield and a reduction in developing time.
Inventors:
Yuichi Hamamura
Yasuo Nakagawa
Fumikazu Ito
Kenkou Miyauchi
Yasuhiko Hara
Yasuo Nakagawa
Fumikazu Ito
Kenkou Miyauchi
Yasuhiko Hara
Application Number:
JP9413494A
Publication Date:
January 14, 2003
Filing Date:
May 06, 1994
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
B23Q41/08; G05B19/418; G06F17/50; H01L21/00; H01L21/02; H01L21/66; (IPC1-7): H01L21/66; B23Q41/08; H01L21/02
Domestic Patent References:
| JP63249328A | ||||
| JP5198651A | ||||
| JP5291102A | ||||
| JP4369760A | ||||
| JP55150221A |
Attorney, Agent or Firm:
Yasuo Sakuta