Title:
【発明の名称】多段ボンディング端子構造のピングリッドアレーの製造方法,その内層端子の削り出し装置及びピングリッドアレー用多層基板
Document Type and Number:
Japanese Patent JP2777425
Kind Code:
B2
Abstract:
PURPOSE:To improve the yield by using a height detecting probe on which a high frequency current is applied on the surface side of a laminated boards, performing spot facing and cutting from the surface layer side of the laminated boards with a rotary cutting blade based on measured data, and exposing an interior bonding terminal circuit. CONSTITUTION:A high frequency current is applied on a probe 41. Then a high frequency magnetic field induced by an eddy current generated in a target conductor layer 64c in laminated bodies is detected with the probe 41. The result is inputted into a CPU 53. In the CPU 53, the distance between a probe tip 41a and the target conductor layer 64c is computed based on the inputted digital value. The distance between the surface of the laminated boards 31 and the target conductor layer 64c can be computed based on the computed distance. Thus, the distance between the tip of a router blade and the target conductor layer 64c is measured. Then, spot facing with a router 24 is performed. Therefore, the depth of the spot facing can accurately be controlled so that a position where an inner-layer bonding terminal 64b is exposed is obtained.
Inventors:
KOMATSU TAKATSUGU
Application Number:
JP26584589A
Publication Date:
July 16, 1998
Filing Date:
October 12, 1989
Export Citation:
Assignee:
NIPPON MIKURON KK
International Classes:
H01R43/00; H01L21/60; H01L23/12; H05K3/46; (IPC1-7): H01L21/60; H01L23/12; H05K3/46
Domestic Patent References:
| JP61125715A | ||||
| JP61136710A | ||||
| JP487671B1 |
Attorney, Agent or Firm:
Minoru Yamada (1 person outside)