Title:
【発明の名称】CADシステムによるプリント基板の製造方法及び部品実装方法
Document Type and Number:
Japanese Patent JP2832787
Kind Code:
B2
Abstract:
PURPOSE:To improve efficiency for manufacturing a printed circuit board by parallelly arranging the graphic data of a surface for printed circuit board manufacture prepared by CAD and the graphic data of a rear face inverted to right and left on the same plane. CONSTITUTION:A front face pattern 1 and a rear face pattern 2 prepared by the CAD are copied in the state of overlapping both of them to the two layers of first and second layers, and both of them are respectively inverted to right and left and turned out. Next, in such an inverted state, a front face pattern 1' and a rear face pattern 2'; overlapped to two layers are moved through the layers and the positions are exchanged. Thus, the inverted rear face pattern 2' positioned in the second lower layer is moved to the position of the front face pattern 1' positioned in the first higher layer by a CAD system. Finally, a synthetic pattern 3 is formed by parallelly arranging and synthesizing the non-inverted front face pattern 1 and the inverted rear face pattern 2' moved to the first higher layer side on the same plane.
Inventors:
SUGYAMA NOBUYUKI
Application Number:
JP35878592A
Publication Date:
December 09, 1998
Filing Date:
December 28, 1992
Export Citation:
Assignee:
AHORO GIKEN KK
International Classes:
H05K13/04; G06F17/50; H05K3/00; (IPC1-7): G06F17/50; H05K13/04
Domestic Patent References:
| JP463670U |
Attorney, Agent or Firm:
Suzuki Hideo