Title:
【発明の名称】半導体装置の製造方法
Document Type and Number:
Japanese Patent JP2589471
Kind Code:
B2
Inventors:
KANZAWA AKIRA
Application Number:
JP8482786A
Publication Date:
March 12, 1997
Filing Date:
April 11, 1986
Export Citation:
Assignee:
ROHM KK
International Classes:
H01L21/30; G03C5/00; G03F7/00; G03F7/095; G03F7/26; H01L21/027; H01L21/302; H01L21/3065; (IPC1-7): H01L21/027; G03F7/095; H01L21/3065
Domestic Patent References:
| JP52116174A | ||||
| JP59155927A | ||||
| JP56111221A | ||||
| JP51111072A |
Attorney, Agent or Firm:
Nakazawa Sanosuke