Title:
【発明の名称】半導体装置の製造方法
Document Type and Number:
Japanese Patent JP2628339
Kind Code:
B2
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Inventors:
Takashi Morimoto
Hideo Yoshino
Hideo Akiya
Hideo Yoshino
Hideo Akiya
Application Number:
JP11655788A
Publication Date:
July 09, 1997
Filing Date:
May 13, 1988
Export Citation:
Assignee:
Nippon Telegraph and Telephone Corporation
International Classes:
H01L21/302; H01L21/3065; H01L21/3205; H01L21/768; (IPC1-7): H01L21/768; H01L21/3065
Domestic Patent References:
| JP59184548A | ||||
| JP6331121A |
Attorney, Agent or Firm:
Kugoro Tamamushi (2 outside)