Title:
【発明の名称】半導体装置の製造方法
Document Type and Number:
Japanese Patent JP2687573
Kind Code:
B2
Inventors:
Yutaka Yamada
Application Number:
JP9611189A
Publication Date:
December 08, 1997
Filing Date:
April 14, 1989
Export Citation:
Assignee:
富士通株式会社
International Classes:
H01L21/67; H01L21/301; H01L21/68; H01L21/683; (IPC1-7): H01L21/68; H01L21/301
Attorney, Agent or Firm:
Teiichi