Title:
【発明の名称】半導体ウエハの製造方法
Document Type and Number:
Japanese Patent JP2689536
Kind Code:
B2
Inventors:
Yagi Atsuo
Matsushita Menshi
Matsushita Menshi
Application Number:
JP28459088A
Publication Date:
December 10, 1997
Filing Date:
November 09, 1988
Export Citation:
Assignee:
ソニー株式会社
International Classes:
H01L21/304; H01L21/02; H01L21/76; H01L21/762; H01L27/12; (IPC1-7): H01L21/762; H01L21/304; H01L27/12
Domestic Patent References:
| JP53129590A |
Attorney, Agent or Firm:
Hideaki Ogawa