Title:
【発明の名称】半導体装置の製造方法
Document Type and Number:
Japanese Patent JP2737762
Kind Code:
B2
Inventors:
URABE KOJI
Application Number:
JP33725393A
Publication Date:
April 08, 1998
Filing Date:
December 28, 1993
Export Citation:
Assignee:
NIPPON DENKI KK
International Classes:
H01L21/288; C25D5/02; C25D7/12; H01L21/768; H01L23/522; (IPC1-7): H01L21/768; H01L21/288
Domestic Patent References:
| JP529315A | ||||
| JP5206064A |
Attorney, Agent or Firm:
Yosuke Goto (2 outside)