Title:
【発明の名称】半導体装置の製造方法
Document Type and Number:
Japanese Patent JP2890527
Kind Code:
B2
Inventors:
UEDA KAZUYOSHI
Application Number:
JP26044589A
Publication Date:
May 17, 1999
Filing Date:
October 04, 1989
Export Citation:
Assignee:
NIPPON DENKI KK
International Classes:
H01L29/812; H01L21/304; H01L21/338; H01L29/41; (IPC1-7): H01L21/338; H01L21/304; H01L29/41; H01L29/812
Domestic Patent References:
| JP1149461A | ||||
| JP62113442A | ||||
| JP2159043A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)