Title:
【発明の名称】半導体装置の製造方法
Document Type and Number:
Japanese Patent JP2892706
Kind Code:
B2
Inventors:
OKUDA SHOJI
Application Number:
JP25605089A
Publication Date:
May 17, 1999
Filing Date:
September 29, 1989
Export Citation:
Assignee:
FUJITSU KK
FUJITSU UI ERU ESU AI KK
FUJITSU UI ERU ESU AI KK
International Classes:
G03F7/20; H01L21/027; H01L21/30; (IPC1-7): H01L21/027; G03F7/20
Domestic Patent References:
| JP6197832A | ||||
| JP60132324A | ||||
| JP189734U |
Attorney, Agent or Firm:
Hironobu Onda