Title:
【発明の名称】半導体装置の製造方法
Document Type and Number:
Japanese Patent JP2903866
Kind Code:
B2
Abstract:
PURPOSE:To make it possible to protect a side wall from its peeling off in a process which forms a multiple side wall on a patterned offset side, such as a multiple cylinder type stacked capacitor. CONSTITUTION:In the case when undergoing a process which forms a multiple side wall on a patterned offset side wall, a character-like pattern, such as a process number 10 on a mask which forms an offset is formed with a square- shaped dotted pattern 1 whose side is, say, about 1mum.
Inventors:
MORI HIDEMITSU
Application Number:
JP14383292A
Publication Date:
June 14, 1999
Filing Date:
June 04, 1992
Export Citation:
Assignee:
NIPPON DENKI KK
International Classes:
H01L21/30; H01L21/027; H01L21/68; H01L21/822; H01L21/8242; H01L27/04; H01L27/10; H01L27/108; (IPC1-7): H01L27/108; H01L21/027; H01L21/68; H01L21/822; H01L21/8242; H01L27/04
Domestic Patent References:
| JP60245264A | ||||
| JP2278812A | ||||
| JP2280312A | ||||
| JP468566A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)