Title:
【発明の名称】半導体装置の製造方法
Document Type and Number:
Japanese Patent JP3012643
Kind Code:
B1
Inventors:
Nobuyuki Mori
Application Number:
JP7079799A
Publication Date:
February 28, 2000
Filing Date:
March 16, 1999
Export Citation:
Assignee:
Kyushu NEC Corporation
International Classes:
H01L21/56; B29C39/10; B29C45/14; B29L31/34; (IPC1-7): H01L21/56; B29C45/14
Attorney, Agent or Firm:
Naka Kanno