Title:
【発明の名称】半導体装置の製造方法
Document Type and Number:
Japanese Patent JP3345885
Kind Code:
B2
Inventors:
Kazumi Hirata
Application Number:
JP2000051010A
Publication Date:
November 18, 2002
Filing Date:
February 28, 2000
Export Citation:
Assignee:
NEC
International Classes:
H01L21/027; (IPC1-7): H01L21/027
Domestic Patent References:
| JP7325385A | ||||
| JP4725915A |
Attorney, Agent or Firm:
Minoru Kudo (1 person outside)