【発明の名称】半導体デバイスの製造方法

Title:

【発明の名称】半導体デバイスの製造方法

Document Type and Number:

Japanese Patent JP3361378

Kind Code:

B2

Inventors:

Masaharu Muramatsu
Motohiro Suyama
Akinaga Yamamoto

Application Number:

JP3240494A

Publication Date:

January 07, 2003

Filing Date:

March 02, 1994

Export Citation:

Assignee:

Hamamatsu Photonics K.K.

International Classes:

H01L21/66; H01L23/00; H01L27/148; (IPC1-7): H01L27/148; H01L21/66; H01L23/00

Domestic Patent References:

JP590303A
JP4130668A

Attorney, Agent or Firm:

Yoshiki Hasegawa (3 outside)

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