MANUFACTURE OF MULTILAYER WIRING BOARD

Title:

MANUFACTURE OF MULTILAYER WIRING BOARD

Document Type and Number:

Japanese Patent JPH0774474

Kind Code:

A

Abstract:

PURPOSE: To simplify the formation of polyimide insulation film and to improve reliability by forming the polyimide insulation film using positive type sensitized polyimide precursor composition

CONSTITUTION: A positive type sensitized polyimide precursor composition is polymer A which mainly consists of a structure unit expressed by an equation, where R1 indicates trivalent or tetravalent organic group with at least two carbon atoms, R2 indicates divalent organic group with at least two carbon atoms, R3 indicates alkali metal non, ammonium ion, or an organic group with l-30 carbons. Then, it contains a compound with ethylene unsaturated double combination and amino group and light initiator and/or sensitizer and/or light- reactive monomer. Therefore, by using positive type sensitized polyimide precursor, pin hole defects can be reduced effectively and a multilayer wiring board with an improved reliability and yield can be obtained.

More Like This:

JP2013075963	COMPOUND, POLYMER, AND PHOTORESIST COMPOSITION
JP7145235	Negative actinic ray-sensitive or radiation-sensitive resin composition for organic solvent development, resist film, pattern forming method, electronic device manufacturing method
WO/2019/225460	PHOTOSENSITIVE TRANSFER MATERIAL, CIRCUIT WIRING MANUFACTURING METHOD, AND TOUCH PANEL MANUFACTURING METHOD

Inventors:

OOSHIGE SABUROU
EGUCHI MASUICHI
ASANO MASAYA

Application Number:

JP12957793A

Publication Date:

March 17, 1995

Filing Date:

May 31, 1993

Export Citation:

Click for automatic bibliography generation Help

Assignee:

TORAY INDUSTRIES

International Classes:

G03F7/039; H01L21/312; H01L23/12; H05K3/46; H05K1/00; (IPC1-7): H05K3/46; G03F7/039; H01L21/312; H01L23/12

Next Patent: MESH PATTERN STRUCTURE