Title:
PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JPH0637412
Kind Code:
A
Abstract:
PURPOSE: To provide a printed wiring board easily obtaining stable characteristic impedance regarding the printed wiring board proper to a high-frequency circuit.
CONSTITUTION: A printed wiring board is composed of a substrate 11, a grounding layer 12 formed on the first surface of the substrate 11 so as to cover approximately the whole surface, a signal line 13 shaped on the second surface of the substrate 11 and first and second grounding lines 14, 15, which are formed on both sides of the signal line 13 and top faces of which are more projecting than the top face of the signal line 13.
Inventors:
TAKAGI HIROFUMI
SHIRAI MAMORU
SUGANE MITSUHIKO
YAMAMOTO YOSHITADA
SHIRAI MAMORU
SUGANE MITSUHIKO
YAMAMOTO YOSHITADA
Application Number:
JP18816692A
Publication Date:
February 10, 1994
Filing Date:
July 15, 1992
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H05K1/02; H01P5/08; H05K3/46; H05K3/24; (IPC1-7): H05K1/02; H05K3/46
Attorney, Agent or Firm:
Matsumoto
Next Patent: MULTICHIP MODULE WIRING BOARD