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Title:
WAFER PROBER, IC PROBER, AND THEIR PROBING METHODS
Document Type and Number:
Japanese Patent JPH0621169
Kind Code:
A
Abstract:

PURPOSE: To provide an electric characteristic test for a device stably and effectively in good conditions, by forming a stationary stage for a probe card so that a probe needle can be movable for a desired length in a desired direction after the probe needle is put in contact with an IC electrode pad.

CONSTITUTION: A wafer prober used for an electric characteristic test for an IC in a semiconductor wafer 9 has a stationary stage 7 for fastening a probe card 8. The stationary stage 7 is also used to put a prove needle 1 (a probe electrode) in contact with each IC-device electrode pad to be measured. The probe needle l is made movable for a desired length in a desired direction after the probe needle 1 is put in contact with the IC-device electrode pad. In this way, since the contact pressure and the wiping quantity thereof are set separately as an individual parameter, a wafer probing step can be carried out without an optimizing designing step for an incident angle of the probe needle 1 to the wafer 9.


Inventors:
NAKAMURA HIROHIKO
Application Number:
JP17636192A
Publication Date:
January 28, 1994
Filing Date:
July 03, 1992
Export Citation:
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Assignee:
SEIKO EPSON CORP
International Classes:
G01R1/073; H01L21/66; (IPC1-7): H01L21/66; G01R1/073
Attorney, Agent or Firm:
Kisaburo Suzuki (1 outside)



 
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