PURPOSE: To provide a high heat dissipation integrated circuit package having a member required for heat dissipating function such as a heat spreader in which a thermal expansion coefficient and thermal conductivity can be arbitrarily set, which has excellent matching properties to the coefficient of an opposite material to be adhered such as a chip, a sealing resin, etc., excellent thermal conductivity, improved uniformity of heat reception and heat diffusing effect.

CONSTITUTION: A thermal conductive composite material 25 of a five-layer structure in which a Kovar plate having many through holes in a thickness direction is brought integrally into pressure contact with a copper plate and copper is brought into pressure welding with an Al foil at both side surfaces of a core material exposed on a surface of the plate is so molded in a ship shape as to contain a chip 34. The chip 34 is placed at a center of a recess by brazing, and when a metal cap 37 is placed at a peripheral edge to be sealed, it is sealed with a lead frame 35 with glass 36.