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Title:
METHOD FOR MAKING FLEXIBLE METAL-CLAD LAMINATED PLATES
Document Type and Number:
Japanese Patent JPH0780990
Kind Code:
A
Abstract:

PURPOSE: To provide a double-layer MCF that remains warp-free even after processed with a metal foil, by forming a warp-free and twist-free polyimide layer, by heat treatment and curing at temperatures lower than a drying temperature for many hours, after applying and drying an organic solvent solution of a polyimide.

CONSTITUTION: A product which has gone through a drying process is taken up in the form of a roll before introduced into a curing process, and then is introduced into a long heat treatment process at low temperature as it is. This additional process helps reduce the distribution of a residual solvent in a film, and prevents a polyimide layer 2, 4, 5 from being distorted after curing or baking. An ideal heat treatment condition is a temperature 60 to 90°C lower than the drying temperature. The duration of treatment is several hours to 24 hours. Many hours are needed to move the residual solvent content near the boundary face of a metal foil 1 in the film.


Inventors:
NOMURA HIROSHI
IMAIZUMI JUNICHI
SUZUKI MASAKATSU
OCHI TAKAHITO
SHIOGAI SUSUMU
Application Number:
JP22938993A
Publication Date:
March 28, 1995
Filing Date:
September 16, 1993
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
B32B15/08; B32B15/088; (IPC1-7): B32B15/08
Attorney, Agent or Firm:
Kunihiko Wakabayashi



 
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