PURPOSE: To offer a lead frame which is appropriate for bonding automation with good accuracy of positioning for internal lead end parts, regrading a lead frame for a glass sealing dual-in-line type package wherein the accuracy of positioning for internal lead end parts is maintained also after a mount process.

CONSTITUTION: A part of leads 3 is joined to a sub supporting part 4. The supporting part 4 is joined to a lead frame supporting part 6 via a cutting part 5. Another part of leads 7 is directly joined to the lead frame supporting part 6. This lead frame, after mounted on a ceramic base 8 and after cutting the cutting part 5 joining the sub supporting part 4 to the lead frame supporting part 6, is applied for a lead bending. When the lead bending is performed in this manner, the lead 3 having the sub supporting part 4 is difficult to be subject to the influence by lead bending strains even in glass 9 fusion, since one end thereof is free.