PURPOSE: To simultaneously form a uniform sputter film on both front and back surfaces of an object to be treated in good efficiency, by a method wherein the object to be treated is held by a holder so as to expose both surfaces thereof and sputtering is carried out while the holder is rotated.
CONSTITUTION: Plural objects to be treated such as bar shaped chip groups 25 are arranged in the framework 9 of a holder 7 and clamped by a clamp bolt 12 to hold the plural bar shaped chip groups 25 which are in turn attached in a sputter treating chamber. A motor 17 is rotated to rotate the framework 9 by a revolving mechanism 8 and sputtering is carried out to coat the emitting surface of the front and the back surfaces of each bar shaped chip group 25 with a sputter film. By this method, working efficiency is enhanced and irregularity in characteristics is reduced to enhance yield.
SHIGIYOU YOSHIHARU
TAKEI ICHIROU
INABA KEIZOU
OGIWARA SEIICHIROU
