TAPING MACHINE FOR SEMICONDUCTOR DEVICE

Title:

TAPING MACHINE FOR SEMICONDUCTOR DEVICE

Document Type and Number:

Japanese Patent JPH0717510

Kind Code:

A

Abstract:

PURPOSE: To provide a taping machine for a semiconductor chip which can adjust a guide rail width in a short time according to an emboss tape width.

CONSTITUTION: A taping machine for a semiconductor chip having a pair of guide rails 5 for guiding a long emboss tape comprises a pair of supporting mechanisms 15, 16 for movably guiding and supporting the pair of guide rails 6 in a direction perpendicular to a tape carrying direction Y and a pair of driving means 18a, 18b, 19, 20 for independently moving the pair of guide rails 6 via the pair of supporting mechanisms 15,16.

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Inventors:

NISHIHARA ATSUSHI

Application Number:

JP18695193A

Publication Date:

January 20, 1995

Filing Date:

June 29, 1993

Export Citation:

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Assignee:

SONY CORP

International Classes:

B65B15/04; (IPC1-7): B65B15/04

Attorney, Agent or Firm:

Kuninori Funabashi

Next Patent: TAPE CUTTER