Title:
【発明の名称】半導体素子の保護回路
Document Type and Number:
Japanese Patent JP3381491
Kind Code:
B2
Inventors:
Takeshi Tanaka
Application Number:
JP31202995A
Publication Date:
February 24, 2003
Filing Date:
November 30, 1995
Export Citation:
Assignee:
Mitsubishi Electric Corporation
International Classes:
H02H3/20; H02H7/00; H02H7/12; H02M1/00; H02M1/06; H02M3/155; H03K17/08; (IPC1-7): H02H3/20; H02H7/12
Domestic Patent References:
| JP4165916A | ||||
| JP7297358A | ||||
| JP7170654A | ||||
| JP6296362A | ||||
| JP318220A | ||||
| JP24009A |
Attorney, Agent or Firm:
Kaneo Miyata (1 person outside)