Title:
【発明の名称】レジスト剥離方法、これを用いた薄膜回路素子の製造方法、および、レジスト剥離液
Document Type and Number:
Japanese Patent JP3095296
Kind Code:
B2
Abstract:
A resist is peeled without leaving a residue after peeling, by bringing a resist-peeling liquid comprising a primary aliphatic amine of 2-6 carbon atoms into contact with the surface of an etched novolak positive photoresist, and removing the resist-peeling liquid containing the thus peeled resist from the surface of the etched resist. The used resist-peeling liquid can easily be recovered and regenerated.
Inventors:
Hiroshi Kikuchi
Yasushi Sano
Satoru Todoroki
Sai Oka
Toshiyuki Koshita
Masato Kikuchi
Mitsuo Nakatani
Norio Tsukii
Yasushi Sano
Satoru Todoroki
Sai Oka
Toshiyuki Koshita
Masato Kikuchi
Mitsuo Nakatani
Norio Tsukii
Application Number:
JP27193192A
Publication Date:
October 03, 2000
Filing Date:
October 09, 1992
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
C09D9/00; C11D7/32; G03F7/42; H01L21/027; H01L21/30; H01L21/302; C23F1/00; H01L21/3065; H05K3/06; G02F1/1362; (IPC1-7): G03F7/42; C09D9/00; C23F1/00; H01L21/027; H01L21/3065; H05K3/06
Domestic Patent References:
| JP63163352A | ||||
| JP6295531A |
Attorney, Agent or Firm:
Kazuko Tomita