Title:
TESTING METHOD OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS6041239
Kind Code:
A
Abstract:
PURPOSE:To perform a heat resistance test of solder by passing a semiconductor through an atmosphere having the prescribed temperature. CONSTITUTION:A rotary system, a belt 2 and a heater block 3 are provided, and the block 3 is heated to the prescribed temperature distribution. To perform a test, a piece 5 to be tested (miniflat package) is placed on a metal 4 having good thermal conductivity, and passed on the block 4. Thus, the heat resistance of the solder is discriminated from the state of the piece 5 after passing.
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Inventors:
TOMITA YUKIO
Application Number:
JP14988783A
Publication Date:
March 04, 1985
Filing Date:
August 17, 1983
Export Citation:
Assignee:
NIPPON ELECTRIC CO
International Classes:
H05K3/34; G01R31/26; H01L21/66; (IPC1-7): G01R31/26; H01L21/32; H05K3/34
Attorney, Agent or Firm:
Uchihara Shin
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