Title:
【発明の名称】ウエーハの再方向付け機構を有する半導体処理装置
Document Type and Number:
Japanese Patent JP2003526193
Kind Code:
A
Abstract:
A lift/tilt assembly for use in a semiconductor wafer processing device is set forth. The lift/tilt assembly includes a linear way comprising a fixed frame and a moveable frame. A nest for accepting a plurality of semiconductor wafers is rotatably connected to the moveable frame. The nest rotates between a wafer-horizontal orientation and a wafer-vertical orientation as it is driven with the movable frame by a motor that is coupled to the linear way. A lever connected to the nest provides an offset from true vertical for the nest when the nest is in the wafer-vertical orientation.
Inventors:
Hanson, Kyle
Dates, Mark
Utzdraff, Daniel Jei
Jira, brad
Dates, Mark
Utzdraff, Daniel Jei
Jira, brad
Application Number:
JP2000513782A
Publication Date:
September 02, 2003
Filing Date:
January 05, 1998
Export Citation:
Assignee:
Semi-Tooth Incorporated
International Classes:
B65G49/07; B25J9/06; C25D7/12; H01L21/00; H01L21/677; H01L21/68; H01L21/687; (IPC1-7): H01L21/68; B25J9/06; B65G49/07; C25D7/12
Attorney, Agent or Firm:
Heiyoshi Odashima