Title:
【発明の名称】センサおよびその製造方法
Document Type and Number:
Japanese Patent JP3447062
Kind Code:
B2
Abstract:
Pads 24 and 25 to be bonded to connection members are formed at positions where the pads face electrode extraction holes 4a to 4c. A bonding agent 12 low in wettability for the surfaces of electrodes 1 and 3 is used. The bonding agent 12 and high-wettability material form the surfaces of the pads 24 and 25. This can firmly bond the connection members to the electrodes 1 and 3, and can prevent the electrodes 1 and 3 from short-circuiting.
Inventors:
Takashi Kihara
Yoshiyuki Ishikura
Homare Masuda
Yoshiyuki Ishikura
Homare Masuda
Application Number:
JP54563199A
Publication Date:
September 16, 2003
Filing Date:
March 11, 1999
Export Citation:
Assignee:
YAMATAKE CORPORATION
International Classes:
G01L9/00; G01P1/02; G01P15/08; G01P15/125; (IPC1-7): G01L9/12; G01P15/125; H01L29/84
Domestic Patent References:
| JP7113817A | ||||
| JP63192203A | ||||
| JP58198739A | ||||
| JP5264576A | ||||
| JP6163935A | ||||
| JP9501231A |
Attorney, Agent or Firm:
Masaki Yamakawa