Title:
【発明の名称】信号処理を一体化したセンサモジュール
Document Type and Number:
Japanese Patent JP2002538425
Kind Code:
A
Abstract:
A sensor module comprises a radiation-sensitive sensor element ( 12 ), a sensor signal processing circuit ( 13, 41 a, 44 a) receiving the output signal of the sensor element ( 12 ) and obtaining a radiation-dependent first electric signal therefrom, a temperature-sensitive reference means ( 14, 15, 41 b, 43, 44 b) providing a temperature-dependent second electric signal and a signal combining means ( 16 ) for combining the two electric signals. The sensor signal processing circuit ( 13, 41 a, 44 a), the reference means ( 14, 15, 41 b, 44 b) and the combining means ( 16 ) are formed on a single chip ( 20, 21 ), and the chip ( 20, 21 ) and the sensor element ( 12 ) are accommodated in a common housing ( 22, 62, 64 ).
Inventors:
Schiefferdecker, Jörg
Schulze, Misha
Schulze, Misha
Application Number:
JP2000601410A
Publication Date:
November 12, 2002
Filing Date:
February 23, 1999
Export Citation:
Assignee:
Perkin Elmer Optoelectronics Game Beher
International Classes:
G01J5/04; G05D23/27; H05B6/68; H05B6/80; (IPC1-7): G01J5/04; G01J5/00; G01J5/08; G01J5/10
Attorney, Agent or Firm:
Sanshin Iwao