Title:
【発明の名称】熱硬化可能な接着剤およびこれを用いた電気的コンポーネント組立体
Document Type and Number:
Japanese Patent JP2589239
Kind Code:
B2
Abstract:
An adhesive material 120 including a fluxing agent is applied to either a substrate 100 having a metallization pattern 110 or a solder bumped electrical component 130. The component 130 is positioned on the substrate 110 and the solder bump 140 is reflowed. During the reflow step, the fluxing agent promotes adhesion of the solder 140 to the substrate metallization pattern 110, and the adhesive material 120 is cured to mechanically interconnect and encapsulate the substrate 110 to the component 130.
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Inventors:
ROBAATO DABURYU PENISHI
MAAKU BUI PAPAJOOJI
MAAKU BUI PAPAJOOJI
Application Number:
JP27209091A
Publication Date:
March 12, 1997
Filing Date:
September 24, 1991
Export Citation:
Assignee:
MOTOROLA INC
International Classes:
B23K35/36; B23K35/363; H01L21/60; H01L21/56; H05K3/30; H05K3/34; (IPC1-7): H01L21/60; B23K35/363
Domestic Patent References:
| JP3196650A | ||||
| JP4122037A | ||||
| JP57132334A | ||||
| JP4292803A |
Attorney, Agent or Firm:
Yoshiaki Ikeuchi