PURPOSE: To make possible a stable thermocompression bonding work of circuit patterns to thermocomporession bonding parts at several microns level by a method wherein the realization of the parallelism among a substrate or a tape formed with a plurality of the circuit patterns, a plurality of the thermocompression bonding parts formed on a semiconductor and the surface of a tool for thermocompression bonding use is conducted by a conformable structure using one point concentration pressing of a pressing force.

CONSTITUTION: A thermocompression bonding work of circuit patterns 4a to 4i formed on an insulating tape 5 to thermocompression bonding parts 8a to 8i conducted by a conformable structure, wherein when the base of a triangular pyramid of force with pressing part 1 as its top comes into contact to the upper parts of all the parts 8a to 8i and patterns 4a to 4i, the position of the pressing part 11 is set in such a way as to come on the vertical line to the parts 8a to 8i from the position of the resultant center of gravity of the parts 8a to 8i. Thereby, the setting of the parallelism among the parts 8a to 8i, the 4a to 4i and the pressing part 11 at several microns level can be automatically realized. Moreover, as the top of the triangular pyramid of force coincides with the point of the resultant center of gravity of the parts 8a to 8i and the part 11, a pressure, which is applied to the part 11, can press uniformly all the parts 8a to 8i and patterns 4a to 4i.