EQUIPMENT FOR MANUFACTURING RESIN SEAL TYPE SEMICONDUCTOR

Title:

EQUIPMENT FOR MANUFACTURING RESIN SEAL TYPE SEMICONDUCTOR

Document Type and Number:

Japanese Patent JPS6092626

Kind Code:

A

Abstract:

PURPOSE:To prevent the creeping of a resin to the surface of a metallic block, to eliminate the need for a resin-burr removing process and to reduce processes by forming structure in which the lower surface of the metallic block is pushed strongly against a bottom force by bending repulsive force. CONSTITUTION:A bottom force 4 in a resin seal force has an angle theta while using a point C in the vicinity of the root of the projecting section of a metallic block 1 as the starting point. Accordingly, when the metallic block 1 is clamped by a pair of sealing forces of the bottom force 4 and a top force 5, the surface to be exposed from device proper of said metallic block 1 is pushed strongly against the surface of the force by the bending repulsive force F of metallic block 1 itself by the clamping pressure of P1 and P2 in the metallic block 1, and the creeping of a resin to the exposed surface is prevented effectively.

Inventors:

SHINOHARA AKIRA
ISHIGURO TSUTOMU

Application Number:

JP20162683A

Publication Date:

May 24, 1985

Filing Date:

October 27, 1983

Export Citation:

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