PURPOSE: To contrive to achieve superior temperature control by heating relatively and mainly a molding portion at high temperature and its surrounding portion at lower temperature than that of the molding portion, using the heating plate with partially different thermal conductivity of its surface.
CONSTITUTION: A molding portion is kept at a suitable temperature for the purpose of molding and its surrounding portion is kept at the lower temperature than that of the molding portion or at the condition without heating at all. The suitable temperature portion corresponding to the shape, thickness, etc. of a molded product and the arranged condition of a mold, and the portions heated at the higher temperature or the lower temperature than that of the suitable temperature portion may be arbitrarily set. The lower temperature and the higher temperature in this case are relative and are generally determined by using the softening temperature and the heating time of the sheet as a reference. Recessed portions 3 are provided on a heating plate 1, whereby while opposing the recessed portion to a molding peripheral portion, the molding portion is heated at high temperature, and its surrounding portion may be heated at the lower temperature than that of the molding portion. Consequently, a print positioning molding is easily carried out.
ABE KEIJI
YAMAGUCHI KATSUHIRO
KUROSAWA EIJI
WATANABE YOSHIROU
SATOU KENJI
TADA NOBUO
TAKEUCHI ATSUSHI
FURUSAWA YUKIO
MIURA KATSUHIKO
HASEGAWA TAKESHI
NOGUCHI TOSHIAKI
TAKAGI HIDEYASU
HIROZAWA KUNINORI
AKIYAMA HIROYUKI
OGURA CHIYUUKIYUU
JAPAN STYRENE PAPER CORP
| JPS59199206A | 1984-11-12 | |||
| JPS5898218A | 1983-06-11 | |||
| JPS5639258A | 1981-04-14 | |||
| JPS5860414U | 1983-04-23 |