Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS58136
Kind Code:
A
Abstract:
PURPOSE:To inhibit the generation of bubbles, and to obtain the excellent characteristic of radiation by forming the section of the edge section of a substrate or a stem in arcuate shape. CONSTITUTION:The section of the edge section 11'contacting with the soldering surface of the Mo substrate 11 with approximately 0.8mm. thickness is formed in arcuate shape in approximately 0.5mm. radius, and angles as the section of the stem 14 are not formed. Solder 13 is placed onto the Mo plate 11 and melted, a semiconductor element 12 is turned several times and rubbed, and the sides of the substrate 11 and the element 12 are paralleled and stacked. Bubbles hardly remain in the solder through the movement of the element, the back of the element is moistened by the solder 13, and a solder lump is formed to the contacting section of the element and the substrate by surface tension. When force to the element is released under this condition, the element returns to the central section by the surface tension. The element 12 is fixed horizontally onto the substrate 11 by means of a tool. According to this constitution, excellent radiating property is obtained and the reliability of the device is also improved.
Inventors:
KINOSHITA YOSHINORI
YAGI MUTSUO
YAGI MUTSUO
Application Number:
JP9856981A
Publication Date:
January 05, 1983
Filing Date:
June 25, 1981
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H01L21/52; H01L21/58; (IPC1-7): H01L21/58
Attorney, Agent or Firm:
Koshiro Matsuoka
Next Patent: WORK TABLE OF MACHINE TOOL