Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS5910288
Kind Code:
A
Abstract:
PURPOSE:To facilitate the discrimination of marking by a method wherein a semiconductor element and a lead are sealed with a transparent mold body, and a mark is so provided at the sealed part of the lead as to be seen through the transparent body from the outside. CONSTITUTION:The mark 4 which represents the model type and specification of the element, manufacturing lot numbers, etc. is marked at the wide part 5 whereon a pellet 6 is mounted by means of printing or stamping. The semiconductor element 6 is bonded in pellet, and an electrode of the element 6 and the other lead 2 are wire-bonded by a Au wire 7. The transparent mold body 8 is obtained by modling with transparent resin or glass. The mark 4 can be read through the transparent mold body 8 because of being provided on the lead, etc. inside instead of on the mold body. The mark 4 is protected inside the transparent mold body, therefore it is not exfoliated.
Inventors:
HIRASHIMA KENJI
HORIE MASAYUKI
HORIE MASAYUKI
Application Number:
JP11857382A
Publication Date:
January 19, 1984
Filing Date:
July 09, 1982
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L23/00; H01L33/54; H01L33/56; H01L33/62; (IPC1-7): H01L23/00; H01L33/00
Attorney, Agent or Firm:
Toshiyuki Usuda
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