PURPOSE: To facilitate transferring a different kind of a lead frame and a change of a kind by disposing finger members capable of opening and closing and moving along guide rails between a pair of parallel guide rails for a lead frame in a lead frame transfer device for a semiconductor assembling machine.
CONSTITUTION: When cams 88A, 88B are rotated by a motor, support plates 82A, 82B, 83A, 83B are turned round shafts 86A, 86B, 87A, 87B by the operation of followers 89A, 89B following profiles of the cams, so that finger levers 73A, 73B are turned to open upper fingers 75A, 75B. In the same manner, lower fingers not shown are opened by finger levers 74A, 74B. Subsequently, a screw member 60 is turned by a motor not shown so that the fingers are moved to the loader 101 side for one device through a female screw 66 and finger levers 73, 74. After that, the fingers are closed by the latter half rotation of the came 88A, 88B to clamp a lead frame 12, and then the finger members are retreated. This arrangement can facilitate a change of a kind.
SUGIURA KAZUO
TORIHATA MINORU
| JPS57206098A | 1982-12-17 | |||
| JP46040153A | ||||
| JPS57139988A | 1982-08-30 | |||
| JPS543883A | 1979-01-12 | |||
| JPS4975178U | 1974-06-28 | |||
| JPS5820230U | 1983-02-08 |
Next Patent: LEAD FRAME TRANSFER DEVICE