Title:
FLAT-TYPE SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS5814542
Kind Code:
A
Abstract:
PURPOSE:To facilitate positioning a semiconductor element by providing three pawls for positioning the element at the inner periphery of a circular flange, by providing another circular flange around an anode block, and by welding these circular flanges. CONSTITUTION:Three pawls 22a are attached to the inner periphery of a circular flange 22 made of metal, and the ends of the pawls are bent almost perpendicularly. Then, the flange 22 is brazed to an insulation ring 1. Another circular flange 5 is fitted to the periphery of the anode block 4 and welded to the flange 22. A semiconductor element 7 set on the anode block 4 is positioned and retained by the pawls 22a of the flange 22. That is, an element fixing plate and the circular flange are formed monolithically. Therefore, they are not separated by a force of shock. This constitution unnecessitates specific processes and material for positioning the semiconductor element, thus making it possible to obtain a flat-type semiconductor device having excellent positioning precision.
Inventors:
HATAKEYAMA MIKIO
Application Number:
JP11196281A
Publication Date:
January 27, 1983
Filing Date:
July 17, 1981
Export Citation:
Assignee:
NIPPON ELECTRIC CO
International Classes:
H01L21/52; H01L23/051; (IPC1-7): H01L21/58
Attorney, Agent or Firm:
Uchihara Shin