Title:
MANUFACTURE OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS58135
Kind Code:
A
Abstract:
PURPOSE:To equalize the thickness of a mold for dampproofing, and to improve reliability by dropping an alpha-rays shielding material, which hardly contains a solvent, onto a chip, placing an insulating thin-film onto the chip, flattening the surface and curing the material. CONSTITUTION:The alpha-rays shielding material 8 such as silicon, which hardly contains the solvent, is dropped, and the insulating resin thin-film 11 is placed during the time when the material is under a liquefied condition. The thin-film 11 is made approximately 50mum when silicon film thickness is 100mum, and a distance between the chip 1 and one side of the thin-film 11 is made approximately 200mum, and the material is cured under a condition that the surface is flattened approximately. According to this constitution, alpha rays are shielded while the thickness of the mold for dampproofing is equalized, and the reliability of the device is improved.
Inventors:
KOJIMA HARUO
Application Number:
JP9856581A
Publication Date:
January 05, 1983
Filing Date:
June 25, 1981
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H01L23/29; H01L21/56; H01L23/31; (IPC1-7): H01L23/28
Domestic Patent References:
| JPS57201033A | 1982-12-09 |
Attorney, Agent or Firm:
Koshiro Matsuoka
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