Title:
CONNECTING METHOD OF LEAD WIRE TO ELECTRONIC PART ELEMENT
Document Type and Number:
Japanese Patent JPS6030145
Kind Code:
A
Abstract:
PURPOSE:To simplify batch treatment for a connection of a lead wire to a small-sized element, to improve yield and to enhance mass-producting capability by using a specific jig. CONSTITUTION:A jig 6 has a plurality of recessed sections 7, 8 for fitting elements 1 to both the surface and the back m1, m2, a plurality of first grooves 9, 10 crossing on bottoms of the recessed sections 7, 8, a plurality of second grooves 11, 12 crossing in the upper-end openings of the recessed sections 7, 8 and vacuum suction holes 13 on bottoms of the recessed sections. First lead wires 15 are inserted into the first grooves 9, 10 in succession, a vacuum pump 14 is operated, and the elements 1 coated with solder 18, 19 are inserted one by one and sucked under a vacuum. Second lead wires 16 are inserted into the second grooves 11, 12 in succession, and the evacuation of the vacuum suction holes 13 is stopped. The whole is passed through a heating furnace to melt the solder 18, 19 on the elements 1, and the lead wires 15, 16 are soldered collectively on each element 1.
Inventors:
YANAGI AKIHIRO
Application Number:
JP13912883A
Publication Date:
February 15, 1985
Filing Date:
July 28, 1983
Export Citation:
Assignee:
KANSAI NIPPON ELECTRIC
International Classes:
H01C7/02; B23K1/00; H01G13/00; H01L21/60; H01R43/02; (IPC1-7): H01L21/60
Attorney, Agent or Firm:
Shogo Ehara