Title:
SOLDER COVERING METHOD AND DEVICE
Document Type and Number:
Japanese Patent JPS6092067
Kind Code:
A
Abstract:
A soldering technique is provided especially for printed circuit boards wherein a bath of solder assisting fluid such as non-ionic surface active agent is superposed on a bath of solder. In one form, the workpiece is passed through the bath of solder assisting fluid and solder is pumped from the bath of solder to a trough whereat the solder is cascaded onto the workpiece. In another form, the workpiece is passed downwardly through the bath of solder assisting fluid into the bath of solder for the application of solder to the workpiece. Thereafter, the workpiece is withdrawn from the bath of solder through the bath of solder assisting fluid. In both instances, while the workpiece is still within the bath of solder assisting fluid, jets of this fluid are played against the workpece to control the thickness of the solder which is allowed to remain on the workpiece. This is accomplished by immersion of fluid levelling knives in the bath of solder assisting fluid with jets being played by these knives onto the workpiece. In addition, provision is made for air blowing the workpiece to remove the solder assisting fluid therefrom. Thereafter, the workpiece is cooled, rinsed and dried.
Inventors:
ROBAATO JII PURAISU
Application Number:
JP19453684A
Publication Date:
May 23, 1985
Filing Date:
September 17, 1984
Export Citation:
Assignee:
MEGATORONITSUKUSU CORP
International Classes:
H05K3/24; B23K1/08; B23K3/06; C23C2/08; H05K3/34; (IPC1-7): B23K1/08; C23C2/08; H05K3/34
Attorney, Agent or Firm:
Kyozo Yuasa
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