Title:
METHOD FOR RECOGNITION AND DISCRIMINATION OF NON-DEFECTIVE IC IN WAFER
Document Type and Number:
Japanese Patent JPS59115534
Kind Code:
A
Abstract:
PURPOSE:To accurately give a decision on a wafer whether it is defective or non-defective by a method wherein a non-defective IC wafer is adhered on glass and the like, IC chips are formed by performing a dicing, a binary signal is obtained by irradiating a beam of light, and a plurality of binary judging areas are provided in the same visual field when a defective-or-nondefective decision is determined. CONSTITUTION:A non-defective IC wafer 3 is adhered on a substrate 1 consisting of glass and the like using a glass cloth 2 wherein thermoplastic wax is impregnated. Then, individually formed chips 10, 11 and so on are obtained by performing a dicing, a beam of light is diagonally irradiated on each chip from a lamp 5 over a press-plate 4, and a defective or non-defective decision is given by a binary system 8 using a prism 6, a camera 7 and the like. However, for the purpose of preventing to give a decision in such a manner that a chip will be present on parts 12 and 13 whereon the glass cloth is exposed, a recognition range showing the bad mark surrounded by lines 20-23 and another recognition range surrounded by cursol lines 24-27 are provided in the visual field of a chip.
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Inventors:
SHIRAKI AKISHI
Application Number:
JP22819682A
Publication Date:
July 04, 1984
Filing Date:
December 23, 1982
Export Citation:
Assignee:
SUWA SEIKOSHA KK
International Classes:
H01L21/66; H01L21/02; H01L21/60; (IPC1-7): H01L21/58; H01L21/66
Attorney, Agent or Firm:
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