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Title:
SURFACE COATED THROW-AWAY CHIP FOR CUTTING
Document Type and Number:
Japanese Patent JPS5855560
Kind Code:
A
Abstract:

PURPOSE: To develop excellent cutting capacity over a long period of time, by forming a softened layer to the scoop-up surface of the base of a surface coated throw-away chip to reduce high temp. plastic deformation as well as to secure toughness.

CONSTITUTION: A WC base pressed powder body is sintered to prepare a throw- away chip made of a WC base hard alloy having a softened layer with a thickness of 10W200μm throughout the total surface thereof. The surface part other than the scoop-up surface of this throw-away chip is removed by grinding and honing is applied to the ground part. In the next process, a hard layer comprising TiCN or the like is formed on the surface thereof by a chemical vapor deposition method or a physical vapor deposition method. Because this surface coated throw-away chip has the softening layer formed only to the scoop-up surface thereof, plastic deformation is hardly generated. Therefore, the recession or the initial abrasion of a blade chip are reduced and excellent cutting capacity is developed over a long period of time.


Inventors:
SUGISAWA TAIJIROU
MURAI SHIYUNICHI
Application Number:
JP15168281A
Publication Date:
April 01, 1983
Filing Date:
September 25, 1981
Export Citation:
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Assignee:
MITSUBISHI METAL CORP
International Classes:
C23C14/06; B23B27/14; B23P15/28; C23C16/30; C23C30/00; (IPC1-7): B23P15/28; C23C11/08; C23C13/04
Domestic Patent References:
JPS57194239A1982-11-29
Attorney, Agent or Firm:
Kazuo Tomita