Title:
THERMOSETTING RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPS59191726
Kind Code:
A
Abstract:
PURPOSE: The titled composition excellent in heat resistance, mechanical strength, moldability, and processability and useful as a material for laminates or an electrical insulating material, containing a specified maleimide compound and a soluble polyimide.
CONSTITUTION: A soluble polyimide is obtained by polycondensing 1,2,3,4-butanetetracarboxylic acid (derivative) with a diamine (e.g., 4,4'-diaminodiphenylmethane) at a molar ratio of 1:1 and a temperature of 150W220°C in a polar solvent (e.g., N-methylpyrrolidone). 15W85wt% di- or poly-maleimide compound of formula I or II (wherein R is a 2C or higher bivalent group and m≥0) and 85W15wt% said polyimide are dissolved in a solvent (e.g., dimethylacetamide) with stirring.
Inventors:
YAMAMOTO YASUSHI
SATOU SADAO
SATOU SADAO
Application Number:
JP6635183A
Publication Date:
October 30, 1984
Filing Date:
April 15, 1983
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
C08G73/00; C08G73/12; (IPC1-7): C08G73/12
Attorney, Agent or Firm:
Masuo Oiwa
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