PURPOSE: To heighten the stability in connection of an electronic machine to the circuit connecting part of the titled semiconductor device by a method wherein eectrode parts to be used for soldering are provided on the back side of a package in such a manner that they are arranged alternately in zigzags, and a narrow-widthed lead wire is connected to each electrode part, thereby enabling to secure the area of the electrode part.

CONSTITUTION: When a number of electrode parts 2 for soldering are going to be provided on the prescribed surface of a substrate 1 which constitutes the back side of a package, said electrode parts 2 are arranged alternately in zigzags, and a narrow-widthed wiring 3 is connected to said electrode parts, thereby enabling to reduce the pitch between the electrodes and to accomplish the improvement in density of the electrodes arranged.